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CNF Lab and Equipment Information
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Hamatech Post CMP Brushcleaner
Wafer processor for cleaning wafers after CMP 
Manager: Rob Ilic
Backup: Edward Camacho
Equipment Training
As this tool is used during CMP, the training for this tool is done in connection with Strasbaugh 6EC training. Contact the tool staff if other training is required. Description:A Hamatech wafer processer has been converted for use as a post CMP brushcleaner. The tool uses a soft PVA sponge 'brush' to remove slurry particles from the wafer surface after polishing. Dilute ammonium hydroxide is added to improve the slurry particle removal. The wafers are then rinsed and spun dry. Additional Resources:Equipment Information SheetOperating Instructions Back to Top |
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PACKAGING & MISC PROCESSING
Chemical Mechanical Polishing CMP - 6EC CorSolutions Microfluidic Probe Station Critical Point Dryer Dicing Saw - KS 7100 Dimatix Printer Hamatech Post CMP Brushcleaner Hot Press Ion Implant - Eaton KS Bonder Microdrill MVD100 PDMS Casting Station Rapid Thermal Processer - AG8108 RTA - AG610 Suss SB8e Substrate Bonder Versalaser Cutting/Engraving Tool Wire Bonder Back to Equipment List |
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This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation. Cornell NanoScale Science & Technology Facility (CNF) 250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700 Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu Powered by ITX |
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