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Click the tool name for detailed information.
THIN FILM DEPOSITION
AJA Sputter Deposition
Load-lock single wafer, AJA sputter tool for deposition of thin metallic and dielectric films
Arradiance ALD Gemstar-6
Arradiance ALD
CHA Evaporator
3 Hearth Thermal Evaporator for Metal Films
CHA-Mark-50-Evaporator
CHA Mark 50 E-beam Evaporator
CVC Sputter Deposition
Magnetron Sputter system for depositing thin metal & dielectric films
Electroplating Hoods
Equipment for electroplating various metals
GSI PECVD
GSI Plasma Enhanced Chemical Vapor Deposition System
OEM Aluminum Nitride Sputtering System
OEM Sputtering System
Oxford ALD FlexAL
Atomic Layer Deposition
Oxford PECVD
Oxford 100 PECVD System
Parylene Deposition
Tool for depositing conformal parylene films (Rm 228)
PVD75 Sputter Deposition
ITO Sputter Deposition System
SC4500 Even-Hour Evaporator
CVC SC4500 E-gun Evaporation System for deposition of thin films
SC4500 Odd-Hour Evaporator
CVC SC4500 Combination Thermal/ E-gun Evaporation System for deposition of thin films
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This material is based upon work supported by the National Science Foundation under Grant No. NNCI-1542081. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation. If you have a disability and are having trouble accessing information on this website or need materials in an alternate format, contact web-accessibility@cornell.edu for assistance. Cornell NanoScale Science & Technology Facility (CNF) 250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700 Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu Powered by ITX |
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