CNF - Lab and Equipment Information

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Click the tool name for detailed information.

PACKAGING & MISC PROCESSING

Chemical Mechanical Polishing CMP - 6EC

Strasbaugh 6EC Chemical Mechanical Polishing Tool

Critical Point Dryer

Equipment for critical point drying of MEMS structures to avoid stiction

Dimatix Printer

Tool for printing a variety of materials onto substrates (Rm 224).

Hamatech Post CMP Brushcleaner

Wafer processor for cleaning wafers after CMP

Ion Implant - Eaton

K&S 7100 Dicing Saw

K&S Thermosonic Gold ball bonder

Custom made drill for microfluidic through holes

Molecular Vapor Deposition Tool for Surface Modification

PDMS Casting Station

Plasma generator,vacuum oven, vacuum jar and scale

Rapid Thermal Processer - AG8108

Rapid Thermal Anneal - AG Associates Model 610

Suss SB8e Substrate Bonder

Universal tool for bonding processes for micro-electro-mechanical systems

Westbond 7400A Ultrasonic Wire Bonder

Cornell University

NYSTAR

NNIN

NSF

This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.

Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu