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CNF Lab and Equipment Information
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Click the tool name for detailed information.
FURNACE PROCESSING
Boron Doping - D1 (Boron Diffusion)
Solid Source Boron Diffusion
Carbon Nanotube/Graphene Furnace (CNTGraphene)
First Nano Carbon Nanotube and Graphene Furnace
CMOS N+ Polysilicon - D3 (CMOS N+ Polysilicon)
CMOS N+ Polyslicon Furnace
CMOS Wet Oxide - E2 (CMOS Wet Oxide)
CMOS Wet Oxidation Furnace
General Material Anneal 1 - A1 (Anneal 1)
MRL Industries Furnace for nitrogen anneals or oxidation of nonelectronic substrates
LPCVD CMOS Nitride - E4 (LPCVD CMOS Nitride)
LPCVD Nitride
LPCVD LTO - B3 (LTO)
MRL Industries Furnace for low temperature oxide deposition on silicon based substrates
LPCVD Nitride - B4 (Nitride)
MRL Industries Furnace for sililcon nitride deposition on silicon based substrates
MOS Clean
Wet Deck for SC-1, SC-2 cleaning of wafers
MOS Clean Anneal 2 - B1 (Anneal 2)
MRL Industries Furnace for annealing silicon compatible substrates
MOS Metal Anneal 3 - C1 (Anneal 3)
MRL Industries Furnace for annealing of silicon based materials with approved metals
MOS Metal Anneal 4 - C2 (Anneal 4)
MRL Industries Furnace for annealing silicon wafers with a limited set of metals
N+/P+ Polysilicon - C4 (N+/P+ Poly)
MRL Industries Furnace for deposition of polysilicon on silicon substrates
Phosphorus Doping - D2
Solid source phosphorus diffusion tube
TFT LPCVD LTO410 - A3 (TFT LTO410)
MRL Industries Furnace for low temperature oxide depositions on TFT compatible substrates
TFT Polysilicon - A4 (TFT NP Poly)
MRL Industries Furnace for polysilicon deposition on TFT compatible substrates
TFT Wet/Dry Oxide - A2 (TFT Oxide)
MRL Industries Furnace for thermal oxidation of TFT compatible substrates
Wet/Dry Oxide - B2 (Oxide)
MRL Industries Furnace for oxidation of silicon substrates
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FURNACE PROCESSING
Boron Doping - D1 Carbon Nanotube/Graphene Furnace CMOS N+ Polysilicon - D3 CMOS Wet Oxide - E2 General Material Anneal 1 - A1 LPCVD CMOS Nitride - E4 LPCVD LTO - B3 LPCVD Nitride - B4 MOS Clean MOS Clean Anneal 2 - B1 MOS Metal Anneal 3 - C1 MOS Metal Anneal 4 - C2 N+/P+ Polysilicon - C4 Phosphorus Doping - D2 TFT LPCVD LTO410 - A3 TFT Polysilicon - A4 TFT Wet/Dry Oxide - A2 Wet/Dry Oxide - B2 Back to Equipment List |
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This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation. Cornell NanoScale Science & Technology Facility (CNF) 250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700 Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu Powered by ITX |
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